OPEN POSSIBILITIES

INDUSTRY SOLUTIONSSemiconductor industry

Rings

Rings

Consumables of etching equipment, etc.

Material: Quartz glass

Semiconductor industry

High-efficiency grinding of quartz glass

POINT 01
Increasing machining efficiency with slope machining utilizing a 5-axis machining center
  • Achieves high-efficiency grinding with C-axis continuous rotation specifications
  • Keeping inclined surface of the workpiece horizontal by tilting the table, making multi-step machining of the inclined surface unnecessary, to improve machining efficiency

Quartz ring machining (similar workpiece)

POINT 02
High-efficiency cutting and a difficult-to-cut material machining package to reduce maintenance
  • Packaging specifications required for difficult-to-cut material machining
  • C-axis continuous rotation specifications
  • Reducing the time and effort required for maintenance with dustproof specifications, enhancement of chip treatment,
    and a filtering system

Enhancing chip cleaning power

POINT 03
Improving area productivity with an extremely narrow machine
  • Handling a maximum workpiece diameter of ø600 with a machine body width of 1,586 mm*1
    Achieves the highest area productivity in its class

*1: With the difficult-to-cut material machining package specifications, a peripheral device is added to the width above

Compact design
Compact design
Extensive stroke
Extensive stroke